Apr. 30 at 8:18 PM
Low attention PR in
$SHMD today, but the implications sit in the AI hardware supply chain.
Schmid rolled out an integrated platform for Any Layer Embedded Trace (ET) processing aimed at high-density panel-level packaging. It combines Deep Reactive Ion Etching for precision trenching + Electrochemical Copper Deposition for uniform fill, all in a tightly controlled environment to preserve ultra-fine circuit integrity.
Key angle: this is directly aligned with the shift toward glass core substrates — critical for thermal stability in next-gen AI chips.
What stands out is scale: support for 700x700mm panels signals serious industrial ambition. This isn’t lab tech, it’s production targeting hyperscale demand, with names like
$INTC and SpaceX-level ecosystem referenced in the positioning.
Follow me 👉@ChipDistribution7 for real-time updates and everything. Let’s make moves!
