Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. Its precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws. The company also offers precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, it is involved...
Industry: Semiconductor Equipment & Materials
Sector: Technology
Phone: 81 3 4590 1111
Fax: 81 3 4590 1188
Address:
13-11 Omori-Kita 2-chome, Ota-ku, Tokyo, Japan
