Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company offers precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, inspection systems, surface planers, and waterjet saws. It also provides precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products....
Industry: Semiconductor Equipment & Materials
Sector: Technology
Phone: 81 3 4590 1111
Fax: 81 3 4590 1188
Address:
13-11 Omori-Kita 2-chome, Ota, Japan
